The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 1983
Filed:
Apr. 07, 1981
Yoichi Kitamura, Yokohama, JP;
Hisashi Hotta, Yokohama, JP;
Toyo Seikan Kaisha Limited, , JP;
Abstract
A retortable bonded TFS can coated with an organic lacquer film in which the seaming portion of the can body is bonded with an organic adhesive, characterized in that (1) the amounts of the metallic chromium layer and the chromium oxide layer deposited are 70-130 mg/m.sup.2 and 5-30 mg/m.sup.2, respectively, as metallic chromium; the amount of alkali-soluble chromium in these layers after heating at 210.degree. C. for 10 minutes is not more than 12 mg/m.sup.2 and not more than 70% by weight of the amount of the deposited chromium oxide before heating; the area of thickness unevenness of the chromium oxide is not more than 10%; and the amount of metal exposed is not more than 30 mg/dm.sup.2, expressed as the amount of copper deposited (2) the organic lacquer film layer is a baked and cured film of a mixed lacquer composed of 70 to 85 parts by weight of an epichlorohydrin-bisphenol A type epoxy resin having a number average molecular weight of 2900 to 3750 and 30 to 15 parts by weight of a resol-type phenolic resin derived from a monohydric phenol, bisphenol A and an aldehyde; the phenolic resin has such a molecular weight distribution that the proportion of a high-molecular-weight portion having 3 or more rings is 60 to 70% by weight and the proportion of a low-molecular-weight portion having 2 or less rings is 40 to 30% by weight; and the baked and cured film contains 83 to 87 parts by weight of the epoxy resin and 17 to 13 parts by weight of the phenolic resin, and (3) the adhesive is a linear polyamide adhesive.