The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 1983
Filed:
Dec. 22, 1980
Asahi Kasei Kogyo Kabushiki Kaisha, Osaka, JP;
Abstract
In manufacturing a fine-patterned thick film conductor structure, a thin film conductor layer having a film thickness of 0.1-10 .mu.m is formed on an insulating substrate and conductive material is then electroplated on the thin film conductor layer to the thickness of 34.9-190 .mu.m under the condition of a cathode current density of no less than 5 A/dm.sup.2. In patterning the conductors, a film thickness-to-conductor interspacing ratio is selected to be no less than 1.4 to prevent widthwise thickening of the conductors in the electroplating process. Resulting conductor structure has a circuit density of no less than 5 lines/mm and a film thickness of 35-200 .mu.m. It is useful for a high density printed circuit board and a miniature coil.