The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 1983
Filed:
Feb. 01, 1982
Rudolph J Zeblisky, Hauppauge, NY (US);
Kollmorgen Technologies Corporation, Dallas, TX (US);
Abstract
The metallic surfaces of plating equipment in use during electroless copper deposition, such as vessels, racks supporting substrates being plated, plumbing, and the like are rendered substantially resistant to electroless copper deposition for extended periods by initially imposing on such equipment surfaces an electrical potential more positive than the mixed potential of the electroless copper solution and sufficiently positive to resist electroless deposition, electrolessly depositing copper on the substrate being plated, and while depositing such copper maintaining on the equipment surface a potential sufficiently positive to resist the formation of adherent electroless copper deposits.