The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 1983

Filed:

Jun. 07, 1982
Applicant:
Inventors:

Minoru Kitanaka, Nagoya, JP;

Yukichi Deguchi, Otsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
428240 ; 156242 ; 156243 ; 156245 ; 156283 ; 1563066 ; 428253 ; 428281 ; 428282 ; 428283 ; 428284 ; 428285 ; 428286 ; 428288 ; 428297 ; 428402 ; 428901 ; 264257 ; 264258 ; 428298 ;
Abstract

A polyphenylene sulfide (PPS) molded board reinforced with 15-85 wt. % of glass fibers (GF) having a length of at least 5 mm is provided. The molded board is useful as an insulating substrate of a printed circuit board. The printed circuit board is prepared by compressing under heating a mixture or laminate of PPS and GF to form a composite molded board and, at or after the compression step, bonding a metallic foil to a surface the composite molded board. The printed circuit board is excellent in mechanical properties such as impact resistance, thermal properties such as heat distortion temperature and solder resistance, and adhesion between the insulating substrate and the metallic foil.


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