The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 1983
Filed:
Dec. 01, 1980
James M Rice, Sepulveda, CA (US);
The Mica Corporation, Culver City, CA (US);
Abstract
A novel laminate adapted for use in the manufacture of capacitors comprising layers of microthin pin-hole free electroformed copper bonded together by a thin layer of hardened dielectric material, said bonded surfaces of said microthin copper having first been treated to form thereon a superficial coating of cupric oxide, bonded to the outer surfaces of said microthin copper, layers of self-sustaining copper foil, the bonded surfaces of said copper foil having been passivated under reducing or cathodic conditions in an aqueous solution of chromic oxide to passivate the surface thereof and to render said copper foil peelably removable from said microthin copper. A method of forming capacitor networks which comprises establishing a laminate having layers of microthin pin-hole free electroformed copper bonded together by a thin layer of hardened dielectric material, said bonded surfaces of said microthin copper having first been treated to form thereon a superficial coating of cupric oxide, bonded to the outer surfaces of said microthin copper, layers of self-sustaining copper foil, the bonded surfaces of said copper foil having been passivated under reducing or cathodic conditions in an aqueous solution of chromic oxide to passivate the surface thereof and to render said copper foil peelably removable from said microthin copper,