Connector assembly for mounting a module on a circuit board or the like

Abstract

A connector assembly is disclosed for mounting a module on a circuit board or the like without requiring any soldering. The subject assembly includes a header mounted on a circuit board to at least partially enclose an area of contacts integral with the circuit board. A plug assembly is secured to a mating module and adopted to engage in the header. The plug assembly includes an outer housing enclosing an inner housing which is directly attached to the module and movable within the outer housing. At least one series of spring terminals are mounted in the plug assembly with a first portion engaging the outer housing and a second portion bearing against the module carried by the inner housing. Spring bias means are mounted in the outer housing bearing against the opposite side of the inner housing from the terminals. Both the terminal and the bias spring are profiled to assume either a rest condition, or an over centered contacting position so that when the plug assembly is mated into the header there is initially no contact force but subsequently insertion force applied over centers the terminals and the bias spring to place them into an over centered condition in which the terminals engage both the module and the circuit board making good electrical and mechanical contact therebetween. It is particularly of note that no solder is required in the subject invention and that all electrical contacts are made through a mechanical action.