The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 1983

Filed:

Aug. 23, 1982
Applicant:
Inventors:

Hans Schuster-Wolden, Worthsee, DE;

Helmut Freller, Rothenbach, DE;

Hans Kruger, Munich, DE;

Wolfgang Welsch, Baldham, DE;

Andre Peetermans, Poing, DE;

Hans J Rolke, Munich, DE;

Peter Schack, Nuremberg, DE;

Assignee:

Siemens AG, Berlin & Munich, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C / ; G02F / ;
U.S. Cl.
CPC ...
2041 / ; 2041 / ; 350343 ;
Abstract

In order to bring about durable solder joints on transparent thin film electrodes which themselves are not solderable, the conductive layer is treated as follows. First, the conductive layer is applied in a vacuum and, more specifically, in the fully oxidized state, and then a solderable layer is generated on the conductive layer in the same vacuum. The electrode consists preferably of an indiumtin oxide and the solder layer consists of copper. The proposed coating technique is particularly simple since the solder layer requires neither an adhesion aid nor a corrosion protection layer. If it consists of copper, it can withstand without difficulty, if it is thick enough, even small thermal stresses such as occur for instance in the fabrication of liquid crystal displays with cementing frame. The layer system is particularly well suited for the electrode leads of electro-optical displays such as liquid crystal displays.


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