The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 1983
Filed:
Sep. 21, 1978
Applicant:
Inventor:
Douglas E Houston, Ballston Lake, NY (US);
Assignee:
General Electric Company, Schenectady, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 68 ; 357 65 ; 357 67 ; 357 79 ; 357 81 ; 228193 ; 228243 ;
Abstract
A structured copper strain buffer, which is thermally and electrically conductive is provided for use with semiconductor electronic devices. A thermo-compression diffusion bond is used to attach a metallic foil to a structured copper disk to form the strain buffer. The individual strands of copper within the strain buffer are capable of independent movement. The structured copper strain buffer provides a means of attachment to a semiconductor device without causing a stress to be generated at the attached surface of the device as the device expands and contracts with temperature changes.