The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 1983
Filed:
Apr. 21, 1982
Hiroshi Kumazaki, Numazu, JP;
Toshiba Kikai Kabushiki Kaisha, Tokyo, JP;
Abstract
Multiple mold clamping apparatus comprising a plurality of mold clamping stations, each having a fixed die plate with a fixed die, a rest plate which is separated from the fixed die plate by a certain distance a movable die plate with a die opposingly facing the fixed die, and a moving device for moving the movable die plate, a hydraulic cylinder unit is slidably mounted beneath the rest plate and includes a piston rod defining an end surface portion for contacting the movable die plate, a power transmitting device mounted on the movable die plate for transmitting clamping force from the piston rod to the movable die, and a conveying device for conveying the hydraulic cylinder unit from one mold clamping station to another.