The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 1983
Filed:
Feb. 20, 1981
Koh Agatsuma, Haijima, JP;
Kenichi Koyama, Tokorozawa, JP;
Itaru Todoriki, Tanashi, JP;
Osamu Kohno, Chiba, JP;
Takashi Saito, Yokohama, JP;
Agency of Industrial Science and Technology, Tokyo, JP;
Fujikura Cable Works, Ltd., Tokyo, JP;
Abstract
A method for manufacturing a Nb.sub.3 Sn superconductor comprising the steps of preparing a composite conductor element which is composed of Cu-Sn alloy matrix and one or more Nb cores inserted and disposed in said matrix, if necessary sheathing the outer surface of the Cu-Sn alloy matrix with copper, subjecting the composite conductor element to a diameter reducing working until the predetermined diameter is reached, then forming an Sn-plating layer on the outer surface of the reduced diameter composite conductor element and thereafter subjecting the Sn-plated composite conductor element to diffusion heat treatment so that an intermetallic compound of Nb.sub.3 Sn is formed, and a method for manufacturing hollow superconducting magnet off an intermetallic compound type comprising the steps of extending a plurality of multicore superconductors together with thin tapes of a low temperature melting metal along grooves of a hollow conductor carrier, winding the superconductor assembly around a magnet reel and then heating up the superconducting magnet assembly to melt the thin tape of low temperature melting metal so that the multicore superconductors are secured to the hollow conductor carrier.