The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 15, 1983

Filed:

Jan. 28, 1982
Applicant:
Inventor:

Edward L Banks, Willingboro Township, Burlington County, NJ (US);

Assignee:

Western Electric Company, Inc., New York, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B / ; B24B / ; H01L / ;
U.S. Cl.
CPC ...
156645 ; 5113 / ; 5128 / ; 156662 ;
Abstract

A semiconductor wafer (31) is placed in a holder (10) and then positioned on a polishing pad (35) in a polishing machine (40). A mechanical force is applied to the holder (10) to cause a predetermined pressure on the wafer (31) therein as the polishing pad (35) is rotated. Simultaneously, water at a pressure slightly higher than the pressure applied to the wafer (31) is injected into the holder to form a water bearing layer between the wafer and the holder that permits free floating rotative motion of the wafer as it is being polished.


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Banks, Edward. (1983). Methods and apparatus for polishing a semiconductor wafer (U.S. Patent No. 4373991). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4373991

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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