The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 08, 1983

Filed:

Feb. 05, 1982
Applicant:
Inventors:

Virinder Grewal, Ebersberg, DE;

Werner Reindl, Unterhaching, DE;

Assignee:

Siemens Aktiengesellschaft, Berlin & Munich, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23F / ; B05D / ;
U.S. Cl.
CPC ...
156656 ; 156665 ; 2041 / ; 357 71 ; 427 90 ;
Abstract

A method for manufacturing solderable, temperable thin film tracks which do not contain precious metal on an electrically non-conductive substrate serving as a carrier employs the steps of applying an adhesive or resistance layer to the substrate, which serves as an intermediate layer, applying a conductive layer over the intermediate layer, and applying a protective anti-corrosion layer over the conductive layer. The protective layer may consist of aluminum or an aluminum alloy, or may be comprised of a combination of a layer of aluminum and a layer of chrome. An aluminum layer may also be applied between the intermediate layer and the conductive layer.


Find Patent Forward Citations

Loading…