The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 1982
Filed:
Jun. 03, 1981
Applicant:
Inventor:
Masahiro Tsuji, Urawa, JP;
Assignee:
Nikon Kogyo Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C / ;
U.S. Cl.
CPC ...
420481 ; 420490 ;
Abstract
A copper alloy for use as a lead material for semiconductor devices, which comprises 0.04-1.0% Ni, 0.01-0.3% Si, and 0.05-15% Zn, all by weight, and the remainder Cu and inevitable impurities. The alloy may contain, in addition to these, a total amount of 0.001-1.0% by weight of one or two or more elements as an accessory ingredient or ingredients selected from the group consisting of 0.001-0.1% by weight each of P and As and 0.01-0.5% by weight each of Ti, Cr, Sn, Mn, and Mg.
Tsuji, Masahiro. (1982). Copper alloy for use as lead material for semiconductor devices (U.S. Patent No. 4366117). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4366117
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile