The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 1982
Filed:
May. 18, 1981
Applicant:
Inventor:
Kiyoshi Yoshizaki, Sagamihara, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
148 / ; 29599 ; 148 / ;
Abstract
A process for producing a compound-based semiconductor wire having a high mechanical strength and which can be coiled so as to be cooled efficiently. A starting composition is formed by blending at least one metal powder selected from among Nb-based and V-based particles having at least a partial surface coating of an alloy or metal selected from Cu-Sn-based and Ga-based metal layers with at least one of Cu-based, Sn-based, Ga-based, Cu-Sn-based and Cu-Ga-based metal or alloy powder. The cross-sectional area of the composition is reduced followed by a heat treatment. The composition is then drawn into a wire of desired diameter.