The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 1982
Filed:
Dec. 12, 1980
Joseph C Carbine, Wyncote, PA (US);
Burroughs Corporation, Detroit, MI (US);
Abstract
The present disclosure describes a probe assembly for use in the testing of integrated circuits. More specifically, the probe assembly finds particular application in high density printed circuit board configurations of flat pack integrated circuit (IC) packages. The invention is characterized by its ability to be readily positioned in either coordinate axis, so as to access all of the IC packages regardless of their mounting position. The probe itself is designed to separate and insulate the IC package leads from one another. Moreover, the point of electrical contact of the probe on the leads is predetermined and reproducible. Finally, the probe automatically locks on to the desired IC leads and exerts a force thereon which is independent of that applied by the operator. Electrical and mechanical damage which might otherwise result to the printed circuit board and the IC package is virtually eliminated by the probe assembly.