The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 1982

Filed:

Sep. 15, 1980
Applicant:
Inventor:

Tatsuya Nakagawa, Matsudo, JP;

Assignee:

Excell Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
264503 ; 264540 ; 264542 ; 425525 ; 425532 ;
Abstract

A lower mold half is horizontally placed. The top surface of the lower mold half is provided with a first groove of any desired shape, one end of which is closed with the other end having a notch for allowing air to be blown in. An upper mold half has a bottom surface which matches the top surface of the lower mold half and which is provided with a second groove corresponding in shape to said first groove. Thus, when the upper and lower mold halves are brought into contact, there is formed a mold cavity defined by the first and second grooves. A discharging unit including a nozzle for discharging a parison is disposed above the lower mold half and the nozzle is so provided that it can rotate in either direction at a variable speed. At least one of the nozzle and the lower mold half is movably provided to lay a parison in the first groove.


Find Patent Forward Citations

Nakagawa, Tatsuya. (1982). Method for molding a plastic pipe (U.S. Patent No. 4362688). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4362688

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…