The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 1982

Filed:

Jan. 05, 1981
Applicant:
Inventors:

Yukio Kobayashi, Yokohama, JP;

Masaaki Kira, Yokohama, JP;

Kinya Yamaguchi, Tokyo, JP;

Assignee:

Showa Denko K.K., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B / ; B29C / ;
U.S. Cl.
CPC ...
264 83 ; 264101 ; 264104 ; 264175 ; 2642893 ; 264294 ; 264343 ; 526285 ;
Abstract

A process for producing a molded article of a high polymer of acetylene, which comprises press-forming a gel-like material or swollen material composed of 5 to 95% by weight of a high polymer of acetylene having a cis content of at least 50% and 95 to 5% by weight of an organic solvent at a temperature of not more than 50.degree. C. and a pressure of 10 to 1,000 kg/cm.sup.2 with or without prior treatment with an electron acceptor or donor substance, and when the treatment with the electron acceptor or donor substance is not performed, calendering or monoaxially stretching the resulting molded article, and if a molded article of an especially high electrical conductivity is desired, treating the molded article further with an electron acceptor or donor substance.


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