The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 1982
Filed:
May. 08, 1981
Applicant:
Inventors:
Charles Carpenter, Poughkeepsie, NY (US);
Joseph F Fugardi, Wappingers Falls, NY (US);
Lawrence V Gregor, Hopewell Junction, NY (US);
Peter S Grosewald, Putnam Valley, NY (US);
Morton D Reeber, Shrub Oak, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
228123 ; 228124 ; 228254 ;
Abstract
A process for forming ball limiting metallurgy pad structure for a semiconductor device solder bond interconnection comprising:
Carpenter, Charles. (1982). Method of forming a solder interconnection capable of sustained high (U.S. Patent No. 4360142). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4360142
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile