The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 1982
Filed:
Sep. 10, 1981
Makoto Shinohara, Crystal Lake, IL (US);
James J Miyashiro, Woodstock, IL (US);
Morton-Norwich Products, Inc., Chicago, IL (US);
Abstract
An improved epoxy molding composition for encapsulating microelectronic devices wherein the molding composition, after conversion to a thermoset condition, i.e., infusible state, by the application of heat and pressure, displays a low coefficient of thermal expansion and a high thermal conductivity. The dual properties of low coefficient of thermal expansion and high thermal conductivity are imparted to the molding composition by the incorporation therein of a specific anisotropic, polycrystalline, sintered ceramic product which is relatively non-abrasive and free of ionic contaminants and which has cordierite as its primary phase, consisting essentially on an analytical oxide basis of 11.5 to 16.5% RO, 33 to 41% Al.sub.2 O.sub.3 and 46.6 to 53% SiO.sub.2.