The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 1982

Filed:

Feb. 18, 1981
Applicant:
Inventors:

Shinichi Yamamoto, Takahama, JP;

Toshihiko Ito, Aichi, JP;

Assignee:

Nippon Soken, Inc., Nishio, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29F / ;
U.S. Cl.
CPC ...
425461 ; 29558 ; 29DI / ; 2641 / ; 2642091 ; 2642098 ; 425197 ; 425380 ; 4253 / ; 425462 ; 425467 ;
Abstract

Method for producing an extrusion die and resulting die for making a honeycomb structure provided with axially extending separate passages. Feed passages and interconnected pooling slots are formed in a metallic die body respectively from opposed end surfaces so as to be communicated with each other. A metallic plate is bonded as by brazing to the end surface provided with the interconnected pooling slots and formed in that plate to communicate with the pooling slots are narrower interconnected extrusion slots having the same shape and size as those of walls of the desired honeycomb structure. Before securing the metal plate to the end surface, holes are made either in the plate or in the end surface, or both, to increase the bonding contact area therebetween.


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