The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 1982
Filed:
May. 16, 1980
C Howard Hamilton, Thousand Oaks, CA (US);
Rockwell International Corporation, El Segundo, CA (US);
Abstract
A method is provided for eliminating internal voids in superplastically forming parts. A blank of material which is capable of being formed superplastically is held opposite a forming surface of a die. The blank is heated to the superplastic forming temperature and pressure is applied to both sides of the blank. This pressure is sufficient to prevent the formation of voids. The pressure on the side of the blank farthest from the die surface is then increased to superplastically form the material against the die surface. In a second embodiment, the pressure is applied after the blank has been formed either by maintaining the forming pressure to compreses the material between the forming pressure and the reaction of the die, or by applying a fluid pressure to both sides of the part, thereby removing voids by plastic deformation and diffusion.