The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 1982
Filed:
Jun. 01, 1981
Daicel Chemical Industries, Ltd., Osaka, JP;
Sumitomo Metal Industries, Ltd., Osaka, JP;
Abstract
There is provided a spot-weldable bonded clad metal plate wherein the metal sheets are 0.05-1.0 mm thick and at least 0.4 mm thick, respectively, the adhesive layer has a thickness of 15-60 microns and the adhesive layer contains 10-100 g/m.sup.2 of metallic powder having a particle diameter corresponding to 0.5-1.5 times the thickness of the adhesive layer. The metallic powder is not necessarily entirely metallic and, for example, glass beads having surfaces coated with a metal can also be used. As the adhesive, a polyamide resin adhesive, particularly, a hot melt type polyamide resin adhesive is preferred. The bonded clad metal plate shows excellent adhesion strength, and in spite of such thin metal sheets, does not blister when spot-welded.