The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 1982
Filed:
Feb. 17, 1981
Masamitsu Nakabayashi, Osaka, JP;
Fumihiro Doura, Sakai, JP;
Reiji Miyamoto, Ichihara, JP;
Tetsujiro Tatsumi, Ichihara, JP;
Takeda Chemical Industries, Ltd., Osaka, JP;
Abstract
A hot-melt adhesive composition containing (i) a first component consisting of (a) 20 to 100 weight percent of a hydrolyzed ethylene-vinyl acetate copolymer whose vinyl acetate unit content is in the range of 5 to 50 weight percent and its hydrolysis degree is at least 50 percent and/or a carboxyl-containing product obtained by grafting said copolymer with a carboxyl-containing unsaturated compound or anhydride thereof and (b) 0 to 80 weight percent of a resin compatible with said copolymer and/or said carboxyl-containing product and (ii) a second component which is a tackifying resin, the proportion of said first component being not less than 20 weight percent and that of said second component being not less than 20 weight percent, both based on said two components, and said composition optionally may further contain (iii) a wax as a third component is highly improved in adhesivity as compared with the hitherto known hot-melt adhesive compositions.