The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 28, 1982

Filed:

Jul. 18, 1980
Applicant:
Inventors:

Makoto Matsui, Kunitachi, JP;

Yasuhiro Shiraki, Hino, JP;

Yoshifumi Katayama, Tokorozawa, JP;

Toshihisa Tsukada, Sekimachi, JP;

Eiichi Maruyama, Kodaira, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D / ; B05D / ; B32B / ;
U.S. Cl.
CPC ...
427 38 ; 427 85 ; 427 82 ; 427 86 ; 427 95 ; 428428 ; 428448 ; 428469 ; 148174 ; 148175 ; 148186 ; 148188 ; 357 49 ; 357 50 ;
Abstract

A semiconductor device is disclosed wherein a polycrystalline film whose principal constituent is silicon is formed on an amorphous or polycrystalline substrate, the polycrystalline film having a carrier mobility of at least 1 cm.sup.2 /V.multidot.sec, and wherein at least one active device is formed by employing the polycrystalline film as its material. A large-area or elongate active device can be provided. The polycrystalline film for such semiconductor device is formed by a method wherein the amorphous or polycrystalline substrate is mounted in a vacuum chamber and wherein the polycrystalline film whose principal constituent is silicon is evaporated on the substrate under the conditions that the pressure during the evaporation is below 1.times.10.sup.-8 Torr and that the partial pressure of oxygen during the evaporation is below 1.times.10.sup.-9 Torr.


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