The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 1982
Filed:
Feb. 18, 1981
Applicant:
Inventor:
Keisuke Kurihara, Yokohama, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D / ; C25D / ; C25D / ;
U.S. Cl.
CPC ...
204 15 ; 204 / ; 204 / ;
Abstract
A method of production of solder coated conductor wiring wherein a lead layer and a tin layer are separately applied to the surface of a ceramic substrate in superposed relation, and subjected to heat treatment at a temperature suitable for alloying the lead and tin into a lead-tin alloy, to provide the solder coated conductor wiring.