The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 1982
Filed:
May. 12, 1980
Applicant:
Inventors:
Shiro Takeda, Sagamihara, JP;
Minoru Nakajima, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03C / ;
U.S. Cl.
CPC ...
427 96 ; 2957 / ; 1566591 ; 430314 ; 430317 ; 430318 ; 430319 ; 430272 ; 430281 ; 430283 ; 430312 ; 427264 ; 427265 ;
Abstract
Electronic devices having a multilayer wiring structure, such as a semiconductor device, a bubble memory device and a thin film magnetic head, are manufactured by using, as an insulation layer-forming material, a thermosetting addition polymerization type polyimide, i.e., a polyimide possessing imide rings in the recurring unit thereof and the degree of polymerization of which increases, when cured, due to the radical reaction of the end group or groups. The polyimide insulation layer exhibits better levelling property than that of a conventional condensational type polyimide.