The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 24, 1982

Filed:

Dec. 08, 1980
Applicant:
Inventors:

Eliezer Kinsbron, Highland Park, NJ (US);

Frederick Vratny, Berkeley Heights, NJ (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
427 96 ; 156643 ; 156656 ; 156657 ; 1566591 ; 156668 ; 427259 ; 427336 ;
Abstract

In an integrated circuit fabrication sequence, a hardened mask pattern adhered to an underlying substrate is removed from the substrate by a solvent that comprises anhydrous hydrazine and dimethyl sulfoxide. The solvent rapidly penetrates the interface between the pattern and the underlying substrate and quickly breaks the adhesive bonds therebetween. Other materials (e.g., Al, Si, SiO.sub.2) in the structure being fabricated are not deleteriously affected by the solvent.


Find Patent Forward Citations

Kinsbron, Eliezer. (1982). Removing hardened organic materials during fabrication of integrated (U.S. Patent No. 4346125). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4346125

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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