The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 1982
Filed:
Aug. 05, 1980
Applicant:
Inventors:
Assignee:
Mitsubishi Rayon Company, Limited, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B29D / ;
U.S. Cl.
CPC ...
15624411 ; 15624427 ; 156289 ; 156330 ;
Abstract
A non-solvent type thermosetting resin film exhibiting excellent uniformity in thickness is prepared by a process wherein a molten thermosetting resin composition having a curing agent incorporated therein is extruded through a linear slit of a flat die, maintained at a constant temperature, onto a release sheet continuously moving at a constant rate in close proximity to the exit end of the linear slit. As the flat die a flat sheeting die having a substantially circular manifold is used and the molten thermosetting resin is extruded onto the release sheet, which is supported by a back-up roll and confronts the exit end of the linear slit of the flat sheeting die.