The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 17, 1982

Filed:

Sep. 18, 1980
Applicant:
Inventors:

Kazufumi Ogawa, Hirakata, JP;

Takao Chikamura, Kyoto, JP;

Takuo Shibata, Hirakata, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03C / ;
U.S. Cl.
CPC ...
430321 ; 430311 ; 430312 ; 430313 ; 2502 / ; 250578 ; 156643 ; 156655 ; 156656 ; 1566611 ;
Abstract

A highly sensitive and high-density picture element solid-state image pickup element and a process for fabricating the same which is featured in (a) that in the step for patterning a photoconductive layer, a protective pattern resisting an etchant is formed by using an ultraviolet-ray-setting resin which is also used in the step for bonding a color filter and then the undesired areas of the photoconductive layer, which has been formed over the whole surface of a wafer, are removed and (b) that the color filter having a stripe or mosaic pattern is bonded to the protective pattern with the same ultraviolet-ray-setting resin. Alternatively, after the color filter has been bonded, the undesired areas of the photoconductive layer are removed with the color filter used as an etching mask.


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