The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 29, 1982

Filed:

Aug. 25, 1980
Applicant:
Inventor:

Seevaram N Varadhachary, Newtown, PA (US);

Assignee:

Congoleum Corporation, Kearny, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; B32B / ;
U.S. Cl.
CPC ...
428420 ; 20415916 ; 20415919 ; 427 541 ; 427302 ; 427333 ; 4273722 ; 4284233 ; 4284244 ; 4284246 ; 4284248 ; 428522 ;
Abstract

A method of improving the bond between dissimilar polymeric materials, such as, for example, a vinyl resin material and a polyurethane or acrylated polyurethane resin material, which comprises: including in the vinyl resin material an acrylate or an acrylated urethane; providing in the polyurethane or acrylated polyurethane resin material an organic peroxide or other UV or thermal activated free radical initiators; bringing the vinyl resin material and the polyurethane or acrylated polyurethane resin material into contact; and exposing the vinyl resin material and the polyurethane or acrylated polyurethane resin material, while in contact, to curing conditions in the presence of said organic peroxide or other UV or thermal activated free radical initiators, whereby there is sufficient chemical interreaction between these resin materials as to create a strong and permanent primary chemical bond therebetween, in addition to any secondary bonds, such as hydrogen bonds and/or van der Waals forces. The present invention also relates to the products involved in and resulting from such methods.


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