The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 1982
Filed:
Dec. 29, 1980
Nippon Telegraph and Telephone Public Corporation, Tokyo, JP;
Nippon Bell Parts Co., Ltd., Tokyo, JP;
Nihon Telecommunication Engineering Corporation, Musashino, JP;
Abstract
Copper-nickel-tin alloys having high tensile strength and conductivity suitable for lead conductor materials for integrated circuits are produced by melting a starting material containing 0.5-3.0% by weight of Ni, 0.3-0.9% by weight of Sn, 0.01-0.2% by weight of phosphorus and 0-0.35% by weight of at least one of Mn and Si other than Cu, casting the molten metal, rolling conventionally the cast into a sheet having a thickness corresponding to more than 60% of cold reduction rate of the final necessary gauge, annealing such a rolled sheet at a temperature of 300-395.degree. C. for 1 hour, cold rolling the annealed sheet and annealing the cold rolled sheet at a temperature of 150-250.degree. C. for 1 hour.