The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 1982

Filed:

Aug. 14, 1980
Applicant:
Inventors:

Hisayasu Mitsui, Yokohama, JP;

Ryozi Kumazawa, Yokohama, JP;

Yoshiyuki Inoue, Yokohama, JP;

Shuichi Suzuki, Yokohama, JP;

Takeo Ito, Kawasaki, JP;

Sinichi Sanada, Yokohama, JP;

Shuzi Hayase, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F / ; B32B / ; B32B / ;
U.S. Cl.
CPC ...
336205 ; 1741 / ; 336206 ; 428324 ; 428363 ; 428413 ; 428417 ; 428418 ; 428429 ; 428447 ; 428454 ; 528 16 ; 528 27 ; 528 92 ; 4284735 ;
Abstract

An electrically insulated coil is composed of a coil and a mica tape containing a first resinous composition, wound upon the coil; the resinous composition containing a maleimide compound, an epoxy resin, a curing catalyst consisting of an aluminum compound, and a curing accelerator selected from the group consisting of a silane compound having a hydroxyl group and a polysiloxane compound having a hydroxyl group; the curing catalyst and the curing accelerator each being in an amount of about 0.0001 to 5% by weight based on the total amount of the maleimide compound and the epoxy resin; and the resinous composition being cured by heating after the mica tape is wound around the coil. The electrically insulated coil may further contain a second resinous composition comprising an epoxy resin and an acid anhydride, the second resinous composition impregnating the mica tape after the mica tape is wound around the coil, and being heat-cured together with the first resinous composition.


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