The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 1982
Filed:
Nov. 29, 1979
Jaroslav Kalal, Prague, CS;
Marie Tlustakova, Prague, CS;
Ceskoslovenska akademie ved, Prague, CS;
Abstract
The invention relates to three-dimensional carriers consisting of inorganic porous material and 0.001-95% of unextractably sorbed reactive polymer of the general formula I: ##STR1## where R.sub.1, R.sub.2, R.sub.4 respectively are hydrogen atom, alkyl with 1-5 carbon atoms, or aryl, and R.sub.3 is the group --COO--(CH.sub.2).sub.n --, and to a method for its preparation. The three-dimensional carriers may be prepared by coating the inorganic porous material with a monomer, which is left to polymerize under the conditions of solution polymerization, while the soluble polymer, which is not bound on the surface of the inorganic material, is removed by extraction. The three-dimensional carrier may also be prepared by depositing a solution of a polymer of general formula I and with a degree of polymerization lower than 10.sup.3 on the inorganic porous material, leaving the two materials in contact with each other, and separating the unbound polymer by extraction. The carriers of inorganic porous material-reactive polymer combine good properties of the inorganic material with the high reactivity of the polymeric coating. An advantage of the carrier is not only the combining of inorganic porous materials with a polymer containing epoxy groups, but also an ample opportunity of modifying the carrier by chemical reactions of the epoxy group. This opportunity may be employed in bonding biologically active compounds, dyes, complex-forming compounds and other low-molecular and high-molecular weight compounds to the carrier.