The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 01, 1982

Filed:

May. 14, 1980
Applicant:
Inventors:

Robert D Huppunen, Cos Cob, CT (US);

Theodore J Morin, New Canaan, CT (US);

Assignee:

Thermatool Corp., Stamford, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C21B / ;
U.S. Cl.
CPC ...
266228 ; 75 61 ;
Abstract

Solder pot apparatus comprising a tank divided into first and second sections by a common wall with holes therein below the level of molten solder in the sections for the transfer of molten metal between the sections. The wall has relatively low heat conductivity. The sections are heated by separately controlled heating elements, the heating elements for the second section having a heating capacity higher than that of the first section, so that solder ingots may be rapidly melted in the second section without substantially affecting the solder temperature in the first section. A ramp extends from the first section to the second section and a powered skimmer stirs metal, and removes dross from metal, in the first section and pushes the dross over the ramp into the second section. Also, the apparatus includes a metal surface level sensor in the second section and signals and an ingot feeder conrolled by the sensor.


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