The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 1982
Filed:
Feb. 28, 1980
Abstract
A test piece is immersed in an electroless plating bath. It is then electrically charged instantaneously via a counter electrode to have a polarization potential .eta.(t) of a few millivolts. The charge consumed by the electroless plating reaction of the test piece is measured by a potential recorder in the form of a variation of the polarization potential .eta.(t) with respect to time t. The .eta.(t)-t relation is analyzed to obtain a resistance R of the test piece. After the potential of the test piece has returns to electroless deposition potential E.sub.ELP, the test piece is charged again until its polarization potential .eta.(t) rises to 50 millivolts or more. A .eta.(t)-t relation is obtained. Based on the .eta.(t)-t relation, a Tafel slope .beta..sub.a of anodic reaction is obtained. After the potential of the test piece has returned to electroless deposition potential E.sub.ELP, the test piece is so charged for the third time as to have its polarization potential .eta.(t) lowered to -50 millivolts or less, and a .eta.(t)-t relation is obtained. This relation is analyzed to obtain a Tafel slope .beta..sub.c of anodic reaction of the test piece. Based on the reaction resistance R, Tafel slopes .beta..sub.a and .beta..sub.c, an electroless plating current density I.sub.ELP is obtained. Based on the electroless plating current density I.sub.ELP, a rate of electroless plating V.sub.ELP is calculated.