The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 1982
Filed:
Jun. 17, 1980
Applicant:
Inventors:
Shozo Hayashi, Tokorozawa, JP;
Susumu Tomiyama, Mitaka, JP;
Assignee:
Tanaka Denshi Kogyo Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C / ;
U.S. Cl.
CPC ...
420511 ; 428620 ; 428641 ; 29589 ;
Abstract
A bonding gold wire for semiconductor elements comprising a gold alloy containing silver (Ag), calcium (Ca), iron (Fe), and magnesium (Mg) with or without an additional element selected from the group consisting of germanium, beryllium, gallium, and thallium, with the substantial balance being gold.