The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 1982
Filed:
Jul. 16, 1980
David L Moore, Jeannette, PA (US);
John A Ostop, Jeannette, PA (US);
Joseph E Johnson, Pittsburgh, PA (US);
Westinghouse Electric Corp., Pittsburgh, PA (US);
Abstract
A glass disc-shaped thyristor is disclosed. The thyristor comprises a body of semiconductive material having a first emitter region, a first base region, a second base region and a second emitter region therein. A cathode electrode and a gate electrode are affixed to one major surface, and an anode electrode is affixed to the second major surface of the body of semiconductor material. The cathode electrode is disc-shaped and is concentrically positioned with respect to the annular-shaped gate electrode. A ring-shaped glass member is affixed to a first major surface of the body of semiconductive material and to the edges of the cathode and base electrodes to form a seal protecting a PN junction at the interface of the first emitter and base regions. An anode electrode is affixed to the second major surface of the body of semiconductive material. A second annular shaped glass member is affixed to the edge of the body of semiconductive material to form a seal protecting PN junctions formed at the interface of the first and second base regions and at the interface of the second base region with the second emitter region. The first and second ring-shaped glass members are formed by fusing glass preforms in an atmosphere comprising a predetermined mixture of nitrogen and water vapor to cause the glass preforms to soften and fuse to the surfaces of the body of semiconductive material to form a protective seals.