The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 20, 1982

Filed:

Dec. 21, 1978
Applicant:
Inventors:

Shiro Takeda, Sagamihara, JP;

Yuji Nagai, Komae, JP;

Minoru Nakajima, Kawasaki, JP;

Kunihiko Hayashi, Yokohama, JP;

Koji Serizawa, Aizuwakamatsu, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ; H05K / ; C08K / ;
U.S. Cl.
CPC ...
361386 ; 29832 ; 294265 ; 174 / ; 174 685 ; 357 69 ; 357 81 ; 525-1 ; 525-4 ;
Abstract

An electronic circuit comprising a circuit substrate with electronic circuit elements bonded onto the circuit substrate with gaps between the circuit substrate and the respective electronic circuit elements has thermal conductive layers comprising an oxidatively curable resin filled into the gaps. The thermal conductive layers are produced by filling a varnish comprising an oxidatively curable resin into the gaps and exhibit excellent moist heat resistance and thermal conductive properties. The electronic circuit elements once mounted on the circuit substrate can easily be removed as required by releasing the bonding between the elements and the substrate.


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