Method for cutting specific layer of synthetic resin laminated film

Abstract

A method for cutting a specific layer of a synthetic resin laminated film comprising at least two kinds of closely laminated synthetic resin material film layers having spectral absorption characteristics different from each other, which comprises placing the focus of a laser ray having a wavelength that enables the laser ray to be absorbed by the specific film layer to be cut and transmitted through the film layer not to be cut, on said specific film layer directly or through the other transmitting film layer; and moving the focus of the laser ray on the plane of said specific film layer, moving said specific film layer on the plane of said specific film layer under a stationary laser focus, or forcing the focus and said specific film layer, respectively, to move in conjunction, keeping the focus on the plane of said specific film layer, whereby said specific film layer only will be selectively cut along the predetermined line or curve.