The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 1982
Filed:
Mar. 05, 1980
Applicant:
Inventors:
Assignee:
Matsushita Electric Industrial Co., Ltd., Kadoma, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
156272 ; 29831 ; 29832 ; 29834 ; 156327 ; 156330 ; 156332 ; 428901 ;
Abstract
A method of mounting electronic components on a printed circuit board by temporarily attaching the electronic component (4) to the circuit board (1) with adhesive (3) applied to the board (1), irradiating the adhesive (3) with ultraviolet rays with or without heating to cure the adhesive (3) and thereby rigidly attach the component (4) to the board (1), and thereafter joining the electrodes (5) of the component (4) to conductor portions (2) on the board (1). Excess adhesive portions (3a) adjoining the component (4) are cured first to subsequently cure the other portion of the adhesive (3) in chain relation to the curing of the excess.