The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 1981
Filed:
Mar. 05, 1980
Applicant:
Inventors:
Assignee:
Matsushita Electric Industrial Co., Ltd., Kadoma, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ; H01L / ;
U.S. Cl.
CPC ...
228-51 ; 228 / ;
Abstract
An improved component engaging apparatus for mounting electrical and electronic components or the like onto a circuit board or substrate which includes a bonding agent applying unit for applying the bonding agent onto the substrate, a chip component mounting section for mounting electronic parts onto the bonding agent on the substrate, a chip component feeding section for sequentially feeding the chip components, a driving section for the chip component feeding section, and a substrate support section which is arranged to alter its position with respect to the chip component mounting section and bonding agent applying section.