The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 1981
Filed:
Aug. 30, 1979
Applicant:
Inventor:
Robert M Stitt, Tucson, AZ (US);
Assignee:
Burr-Brown Research Corp., Tucson, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 14 ; 357 72 ; 357 75 ; 357 80 ; 357 73 ; 174 / ;
Abstract
A molded dual in line package is disclosed which has at least one cavity in a first major molded surface thereof into which an integrated circuit chip can be mounted and wire bonded. After the circuit is tested and adjusted, the cavity is sealed with a metal plate. Other embodiments are disclosed which include a second cavity in a second major molded surface of the package which may house or contain a second integrated circuit, an epoxy sealer, or a substrate.