The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 1981
Filed:
Apr. 06, 1979
James C Lee, Los Altos Hills, CA (US);
Amdahl Corporation, Santa Clara, CA (US);
Abstract
A semiconductor package and electronic array in which the semiconductor packages of the array share a common substrate. The substrate has a plurality of sets of contacts with each set of contacts receiving contacts of a semiconductor chip. Each chip and set of contacts is surrounded by a closed length of bond receptive material. A heat dissipation member is attached to each chip by means of a heat conductive plate, and an annular ring is bonded to each heat dissipation member and to the closed length of bond receptive material to hermetically seal the chip.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile