The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 1981
Filed:
Mar. 11, 1980
Applicant:
Inventors:
Masanori Tanabe, Hitachi, JP;
Satoshi Shimada, Hitachi, JP;
Akio Yasukawa, Chiyoda, JP;
Motohisa Nishihara, Katsuta, JP;
Takeo Nagata, Hitachi, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L / ;
U.S. Cl.
CPC ...
338-5 ; 338-2 ; 357 26 ;
Abstract
A semiconductor substrate has a major surface, another major surface on the opposite side of the first major surface, a strain gauge stripe formed in the central portion of the second major surface by diffusing an impurity therein, and electrodes connected to the strain gauge stripes. These strain gauge stripes are spaced from the peripheral edge of the second major surface by a distance greater than 1/3 of the length of the same major surface. The first major surface of the semiconductor substrate is bonded to an elastic metal load plate.