The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 1981
Filed:
Apr. 04, 1979
Donald B Gore, Swanton, OH (US);
Ronald S Krigbaum, Toledo, OH (US);
James O Peterson, Sylvania, OH (US);
Plaskon Products, Inc., Toledo, OH (US);
Abstract
A urea-formaldehyde corn is mixed or ground with added paraformaldehyde and urea in addition to a catalyst system and other conventional additives to produce a mixture of fine powder. This mixture is optionally densified and granulated. The addition of urea and paraformaldehyde to the corn causes a low viscosity under cold manifold injection condition, which is particularly suited for cold manifold molding applications. The condensation of resin in the corn is preferably kept low by using high formaldehyde: urea ratios and pH values during drying. The plastic life of the molding compound is improved by employing a catalyst system such as zinc sulfate and hexamethylenetetramine. The molding compound is stable at about 82.degree.-110.degree. C. for over about 5 minutes and can be injected at applied pressures of below about 125 megapascals (18,000 psi) at such manifold temperatures with reasonable cycle times and without setting in the sprue or runners.