The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 1981
Filed:
Jun. 18, 1979
Ferdinand Utner, Regensburg, DE;
Siemens Aktiengesellschaft, Berlin & Munich, DE;
Abstract
A process for encapsulating electrical components with a continuous layer of synthetic resin material contemplates induction heating of the component by high frequency current with the component leads covered by heat insulating material, and subjecting the heated component to a vortex bath of synthetic resin powder so as to fuse or sinter the powder to the component. Because the leads have not been heated, no resin is sintered thereto, so that scraping or other removal of resin from the leads to make electrical contact therewith need not be undertaken as an additional step. During hardening of the resin the heat insulation may be left in place on the leads to allow the hardened resin to form 'feet' on a base of the component, or the heat insulation may be displaced slightly to allow flow of the hardening resin around the lead without forming a fillet.