The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 1981

Filed:

Dec. 08, 1978
Applicant:
Inventor:

Morio Yamada, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B65B / ; B65B / ;
U.S. Cl.
CPC ...
414412 ; 198472 ; 5338 / ;
Abstract

A method and apparatus for cutting and peeling the packaging material of an elongated package containing a product comprise gripping the packaging material of the package at the upper portion and all over the length thereof after said package is fed from a feeding section to a certain position in a cutting section, thrusting the cutting blades of a cutter member into the packaging material to cut a continuous cut line between the gripped upper side thereof and the product, forcedly peeling off the packaging material of the package fed to a certain position in a peeling section, discharging the exposed product into a delaying and storing section where the product is shifted stepwise and successively to be delayed and stored therein, and delivering the product to a discharging section where the product is received and discharged successively and intermittently.


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Yamada, Morio. (1981). Method and apparatus for cutting and peeling the packaging material of (U.S. Patent No. 4285625). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4285625

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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