The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 1981
Filed:
Sep. 26, 1978
Tetsuo Nakazawa, Shimoinayoshi, JP;
Junji Sakai, Minorimachi, JP;
Syogo Morimoto, Matsudo, JP;
Takatoshi Tanigawa, Tokyo, JP;
Ryoji Takahashi, Yukuhashi, JP;
Seiji Okazaki, Kitakyushu, JP;
Hitachi, Ltd., Tokyo, JP;
Hitachi Metals, Ltd., Tokyo, JP;
Abstract
In a mold to be hardened by a CO.sub.2 gas, a mold binder material comprising a combination of polymers containing carboxyl groups, at least one of multi-valent metal oxides and multi-valent metal hydroxides, and resins of polyvinyl alcohol group, and at least one of sodium salt of gluconic acid and polyhydric alcohols or a mold binder material comprising a combination of polymers having carboxyl groups, at least one of multi-valent metal oxides and multi-valent metal hydroxides, and at least one of sodium salt of gluconic acid and polyhydric alcohols is provided. By use of the present binder material, the following various effects can be obtained: (1) easy preparation of mold sand, (2) easy removal of the binder material by water washing even if bodies or clothes are fouled by the binder material, (3) a longer working time of mold sands, (4) a higher mold strength, (5) an improved working atmosphere at shaping of the mold, (6) an improved production efficiency of molds, (7) the desired mold strength being obtained with a smaller amount of CO.sub.2 gas used, etc.