The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 1981
Filed:
Dec. 21, 1979
Applicant:
Inventors:
Hitoshi Oka, Yokohama, JP;
Kenji Nakamura, Fujisawa, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C / ;
U.S. Cl.
CPC ...
427-8 ; 427306 ; 427345 ; 4274431 ; 427437 ; 106-123 ; 324438 ; 324 / ; 204 / ;
Abstract
A concentration of copper ions, a concentration of a reducing agent, a concentration of a complexing agent and a pH of a chemical copper plating solution are continuously detected all as potentials, and continuously controlled with a good accuracy.
Quick Actions:
Oka, Hitoshi. (1981). Process for controlling of chemical copper plating solution (U.S. Patent No. 4276323). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4276323
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile