The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 1981
Filed:
May. 16, 1979
Koichi Noto, Yokohama, JP;
Tsuneo Kawai, Yokohama, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
An automatic polishing apparatus having in combination, a polishing machine for effecting the polishing and a profiling device for giving an instruction concerning the path along which the polishing is to be effected to the polishing machine. The profiling device has a tracer adapted to trace and profile a line which has been previously drawn in a drawing in accordance with the configuration of the surface to be ground, and detecting device adapted to detect the displacements of the tracer in the directions of X and Y-axes. The polishing machine includes a feeding arrangement adapted to feed one of a table carrying the article to be ground and a polishing head carrying the polishing tool relatively to the other in the directions of X and Y-axes, in accordance with signals representing the displacements in both directions of the tracer derived from the detecting device of the profiling device. The feed is made at a predetermined proportional ratio to the displacements of the tracer. A detector is carried by the polishing head and is adapted to detect the pressure applied to the polishing tool or a displacement caused by the pressure. A polishing arrangement is adapted to move one of the table and polishing head relatively to the other in the direction of Z-axis in accordance with the output from the detector so as to maintain the polishing tool in contact with the ground surface at a predetermined level of contact pressure to thereby effect a self-guided profiling polishing of the surface. The combination of the profiling device and the polishing machine permits an automatic polishing in accordance with the shape of the free curved surface to be polished.